Cpm

Another type of capability index, Cpm, is much less known and used less frequently than Cpk or Ppk. The main difference between the Cpm and the other capability indices is that the bias from the target, not mean, is directly taken into consideration in the Cpm. The bias is the difference between the process average and the target.

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Cp, Cpk, Pp, Ppk

Process capability, Cp, tells how well a process meets customer’s specifications.  It is defined as the ratio of engineering tolerance (USL – LSL) to the natural tolerance (-3σ to 3σ) . However, a process can be capable of meeting specifications, but not be meeting specifications if the process is not centered relative to the specifications. Therefore, process capability index, Cpk, is introduced to take into account of the centeredness.

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Study the curing reaction of silicone release agent through FTIR

In PSA industry, release liner is one of the key components. The main functions of release liner are to provide protection of the adhesive layer during storage and transportation, and ensure a residue-free removal from the protected adhesive layer without damaging or contaminating it.

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FTIR

Molecular bonds can be considered as stiff springs which can be bent or stretched. The vibration (bending and stretching) energy lies in the infrared (IR) range. Therefore, through the interaction between IR incident beam and molecules in samples to be tested, through transmission or reflection, molecular bonds information can be extracted from the absorption spectra to obtain their molecular structures.

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Inhibitors

In silicone addition curing, inhibitors must be used to exclude the vinyl groups from the platinum at temperatures around room temperature to have enough pot life. At elevated temperatures, e.g. above 80°C, these inhibitors evaporate and dissociate from the platinum, or react with the SiH and become part of the cured matrix. In either case, they can no longer exclude the polymer vinyl groups, and cure takes place rapidly.

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Thermal conductivity measurement (ASTM D 5470, E1530, and E1461)

Thermal conductivity measurements can be divided into two groups: steady state and transient state testing methods. Steady state methods also includes guarded hot-plate (GHP) method and Heat-Flow Meter (HFM), while a typical transient method is Laser/Xenon Flash (LFA/XFA) method.

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