Traditionally, IC interconnects formed from Al; however due to scaling and performances needs, Copper is gradually replacing Aluminum.
Continue reading “Al Vs Cu”Category: Metal foil
A method to reduce nodules on ED copper foil
ED copper foil is broadly used in Li-ion battery and printed circuit boards in electronics industry. However, nodules are commonly observed on the surface of ED copper foil made through a conventional electro-deposition method. Patent of US 9,562.298 B2 teaches a new way to reduce the number of the nodules on the surface.
Continue reading “A method to reduce nodules on ED copper foil”Embedded Thin Film Resistor
Since Embedded Thin film resistors or ETFR can shorten the transmission distance, reduce electromagnetic interference, decrease the installation cost, save the space of the circuit board, it has been broadly adopted in printed wiring board (PWB)
Continue reading “Embedded Thin Film Resistor”Calendared Copper foil Vs Electrolytic Copper foil
The following is a short comparison between Calendared (also called RA copper foil) and Electrolytic copper foil (ED copper foil).
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