In the semiconductor processing, e.g. dicing, grinding, wafers or similar objects need to be held with enough adhesion; after the process completed, the finished parts need to be peeled off easily from the holder. UV release tapes (UVR) are quite suitable for such applications.
UV release tape include a carrier, UV adhesive, release liner. The carrier typically is PVC, PO or PET. The mechanic performances of UVR are largely from the selection of the carrier. Adhesive is Acrylic based mainly with active monomers, cross-linker, photo-initiator, and other functional additives; non-acrylic UVR, e.g. rubber based, is also possible.
After UV illumination, the active monomer form 3D network together with base polymers. The storage modulus of the adhesive dramatically increased, leading to the significant reduction of adhesion. The volume contraction, voids at the adhesive/adherent interface also contributes to the adhesion reduction.
One of the major applications of UVR is for the wafer dicing process.
Above figure about grounding and dicing are statschippac.com