A method to reduce nodules on ED copper foil

ED copper foil is broadly used in Li-ion battery and printed circuit boards in electronics industry. However, nodules are commonly observed on the surface of ED copper foil made through a conventional electro-deposition method. Patent of US 9,562.298 B2 teaches a new way to reduce the number of the nodules on the surface.

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Liquid metal

For liquid metals, people may immediately think of mercury; in fact there are several other metals with melting point close to room temperature in addition to Mercury (Hg, MP=−38.8 °C, e.g. Caesium(Cs, MP=28.5 °C, Rubidium (Rb, MP=39 °C, Francium (Fr, estimated MP= at 27 °C), and Gallium (Ga, MP=30 °C). However, due to the issues of radioactivity, vapor pressure, and toxicity, etc, the practical liquid metal is typically Ga based eutectic alloy with melting point less than that of Ga.

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Accuracy of Steady State Thermal conductivity measurement

The steady state method is commonly adopted to measure thermal resistance and conductivity of thermal interface materials or TIMs. A heat flow through the TIM is generated and the temperature gradient across the TIM is measured, and the thermal resistance or conductivity can be calculated through the procedure defined by ASTM standard ASTM D5470.

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