The following is the comparison among four major thermal conductivity measurements.
Continue reading “Thermal conductivity tests comparison”Category: Thermal
Al Vs Cu
Traditionally, IC interconnects formed from Al; however due to scaling and performances needs, Copper is gradually replacing Aluminum.
Continue reading “Al Vs Cu”Thermally stimulated current measurement
In semiconductors based devices, defects such as dislocations, grain boundaries, and impurities can function charge traps, which in turn play important roles in determining devices properties
Continue reading “Thermally stimulated current measurement”Accuracy of Steady State Thermal conductivity measurement
The steady state method is commonly adopted to measure thermal resistance and conductivity of thermal interface materials or TIMs. A heat flow through the TIM is generated and the temperature gradient across the TIM is measured, and the thermal resistance or conductivity can be calculated through the procedure defined by ASTM standard ASTM D5470.
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Heat flow method can be adopted to measure the thermal contact resistance of two mating samples or thin film materials.
Continue reading “Thermal contact resistance & TIM measurement”Thermal conductivity measurement (ASTM D 5470, E1530, and E1461)
Thermal conductivity measurements can be divided into two groups: steady state and transient state testing methods. Steady state methods also includes guarded hot-plate (GHP) method and Heat-Flow Meter (HFM), while a typical transient method is Laser/Xenon Flash (LFA/XFA) method.
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