Inhibitors

In silicone addition curing, inhibitors must be used to exclude the vinyl groups from the platinum at temperatures around room temperature to have enough pot life. At elevated temperatures, e.g. above 80°C, these inhibitors evaporate and dissociate from the platinum, or react with the SiH and become part of the cured matrix. In either case, they can no longer exclude the polymer vinyl groups, and cure takes place rapidly.

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Thermal conductivity measurement (ASTM D 5470, E1530, and E1461)

Thermal conductivity measurements can be divided into two groups: steady state and transient state testing methods. Steady state methods also includes guarded hot-plate (GHP) method and Heat-Flow Meter (HFM), while a typical transient method is Laser/Xenon Flash (LFA/XFA) method.

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Literature study-F containing UVR formulation

US 8,193,259 B2, with title of “UV-CURABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION WITH A FLUORINATED ACRYLIC BINDER RESINAND PRESSURE-SENSITIVE ADHESIVE FILM USING THE SAME”, teaches a way to formulate UV Release (UVR) adhesive formulation where a fluorinated acrylic segment is introduced to the main chain to deliver excellent pick-up performances after UV illumination.

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