ED copper foil is broadly used in Li-ion battery and printed circuit boards in electronics industry. However, nodules are commonly observed on the surface of ED copper foil made through a conventional electro-deposition method. Patent of US 9,562.298 B2 teaches a new way to reduce the number of the nodules on the surface.
Continue reading “A method to reduce nodules on ED copper foil”Category: Converting process
Cpm
Another type of capability index, Cpm, is much less known and used less frequently than Cpk or Ppk. The main difference between the Cpm and the other capability indices is that the bias from the target, not mean, is directly taken into consideration in the Cpm. The bias is the difference between the process average and the target.
Continue reading “Cpm”Cp, Cpk, Pp, Ppk
Process capability, Cp, tells how well a process meets customer’s specifications. It is defined as the ratio of engineering tolerance (USL – LSL) to the natural tolerance (-3σ to 3σ) . However, a process can be capable of meeting specifications, but not be meeting specifications if the process is not centered relative to the specifications. Therefore, process capability index, Cpk, is introduced to take into account of the centeredness.
Continue reading “Cp, Cpk, Pp, Ppk”Viscosity Vs coating method
The coating methods, fluid viscosity, and line speed are correlated with each other in thin film coating process. The following figure is a good guidance for selecting coating methods and coating parameters
Continue reading “Viscosity Vs coating method”Wafer dicing and grinding
Some nice videos from DISCO company website. Always good to understand the process in order to select or recommend most suitable materials for the best results.
Continue reading “Wafer dicing and grinding”Vacuum coating related suppliers
Vacuum coating related materials/component/equipment Suppliers, particularly in SF Bay Area: Continue reading “Vacuum coating related suppliers”