Some nice videos from DISCO company website. Always good to understand the process in order to select or recommend most suitable materials for the best results.
Dicing before grinding (DBG)
The wafer is initially grooved by using a Half Cut Dicing process. Subsequently, back grinding is performed until reaching the groove and, thus, separating the dies. Dicing before grinding ensures a perfect backside quality and zero edge chipping.
Stealth laser dicing (SD)
Stealth dicing is a zero-waste, dry process which does not require any cleaning. it is a two-stage process. Firstly, the laser beam is focused in the inside of the workpiece creating a so-called modified layer, or SD layer. Secondly, an external force is applied to singulate the dies along the modified layer to separate the dies.
LASER GROOVING
First, the material, which is difficult to be processed by dicing blade, is removed by laser grooving. Laser grooving is followed by step cut or single cut by blade dicing. Chipping or delamination of the low-k layers is reduced to a minimum.