Tumble test and drop test are critical to evaluate a product’s ability to survive the many bumps and scrapes it will experience in its life cycle with an end-user. Tumble test is more random while drop test can control drop orientation, impact point, etc.
Tumble test
Sources: https://www.u-es.com.sg/products-list/drop-and-tumble-tester/tumble-tester-video/
The drop height is 1000mm/500mm; object weight less than 1.5Kg. Tumble test standards:
- IEC 60068-2-31 (incorporated IEC 68-2-32 and BS EN 60068-2-32)
- IEC60312 & DIN60312
- MIL-STD-202G (Method 203C)
Drop test
| Drop Height | 600 – 2000mm |
| Velocity Range | 3.5 – 6.25 m/s |
| Specimen Weight | 1 – 1.5Kg |
Standards:
- MIL-STD-810
- IEC 60601-1
- IPC/JEDEC 9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
- JEDEC 22B110A: Subassembly Mechanical Shock
- JEDEC 22B104C: Mechanical Shock
- JEDEC 22-B111: Board Level Drop Test Method of Components for Handheld Electronic Products
- MIL-STD-202
- IEC 60068-2
- IEC 60950
- GR-63-CORE
Sources: https://www.u-es.com.sg/products-list/drop-and-tumble-tester/drop-tester-video/